Low-travel key mechanisms using butterfly hinges

ABSTRACT

A key mechanism including one or more butterfly hinges. Each butterfly hinge may include a double wing design operative to move between a depressed position and non-depressed position. Hinged coupling mechanisms couple respective arms of the wings together. Additionally or alternatively, a key mechanism can include one or more half-butterfly hinges. Each half-butterfly hinge includes a double wing design operative to move between a depressed position and non-depressed position. A hinged coupling mechanism couples one set of corresponding arms of the wings together, while the other set of corresponding arms are not coupled together.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation patent application of U.S. patentapplication Ser. No. 15/342,715, filed Nov. 3, 2016 and titled“Low-Travel Key Mechanisms Using Butterfly Hinges,” now U.S. Pat. No.9,916,945, which is a continuation patent application of U.S. patentapplication Ser. No. 14/499,209, filed Sep. 28, 2014 and titled“Low-Travel Key Mechanisms Using Butterfly Hinges,” now U.S. Pat. No.9,502,193, which is a nonprovisional patent application of and claimsthe benefit to U.S. Provisional Patent Application No. 61/884,180, filedSep. 30, 2013 and titled “Low-Travel Key Mechanisms Using ButterflyHinges,” the disclosure of which is hereby incorporated herein byreference in its entirety. U.S. patent application Ser. No. 14/499,209is also a continuation-in-part patent application of U.S. patentapplication Ser. No. 14/058,448, filed Oct. 21, 2013 and titled“Low-Travel Key Mechanisms Using Butterfly Hinges,” which is anonprovisional patent application of and claims the benefit to U.S.Provisional Patent Application No. 61/720,373, filed Oct. 30, 2012, andtitled “Low-Travel Key Mechanisms Using Butterfly Hinges,” thedisclosures of which are hereby incorporated herein in their entireties.

TECHNICAL FIELD

The disclosed embodiments relate generally to electronic devices, andmore particularly to input devices for electronic devices.

BACKGROUND

Many electronic devices typically include one or more input devices suchas keyboards, touchpads, mice, or touchscreens to enable a user tointeract with the device. These devices can be integrated into anelectronic device or can stand alone as discrete devices that cantransmit signals to another device either via wired or wirelessconnection. For example, a keyboard can be integrated into the housingof a laptop computer or it can exist in its own housing.

It is often desirable to reduce the size of electronic devices andminimize machining costs and manufacturing time of such devices. Forexample, laptops may be designed to be as small and light as possible,but input devices such as a keyboard may occupy relatively largeportions of the available interior space. One way to alleviate designconstrains of a keyboard is to minimize the z-stackup of key mechanisms.Accordingly, what is needed is an improved key mechanism design.

SUMMARY

In one aspect, a key mechanism includes a butterfly hinge. The butterflyhinged key mechanism according to various embodiments enablesubstantially low travel distances with desired tactile response. Thekey mechanism uses a double wing design operative to move between adepressed position and non-depressed position. In one embodiment, a lowtravel key mechanism includes a keycap assembly, a support structure,and a butterfly hinge having two independently articulating wings, eachwing coupled to the keycap assembly and the support structure, whereineach wing is operative to pivot about its own pivot axis during akeystroke of the key mechanism.

In another aspect, a low travel key mechanism includes a keycap assemblyincludes a support structure, and a butterfly hinge including twoseparate wings positioned adjacent to each other such that a cavity isformed between the two wings, each wing comprising a pair of pivot pinsand a pair of keycap pins, wherein the pivot pins are coupled to thesupport structure and the keycap pins are coupled to the keycapassembly. In addition, a dome switch is secured within the cavitybetween the keycap assembly and the support structure, the dome switchoperative to bias the keycap assembly in a first position.

In yet another aspect, a low-travel key mechanism includes a keycapassembly having a keycap and a substructure having a pair of lockingpivot receiving members and a pair of sliding pivot receiving members.The key mechanism further includes a butterfly hinge having four pairsof pins, wherein a first pair of the pins is securely coupled to thepair of locking pivot receiving members and a second pair of pins ismoveably coupled to the pair of sliding pivot receiving members. Itincludes a support structure that secures third and fourth pairs of thepins in place so that they rotate freely when the key mechanism issubjected to a keystroke, and wherein when the keycap assembly movesvertically up and down with respect to the support structure during thekeystroke event, the second pair of pins moves horizontally within thepair of sliding pivot receiving members.

In another aspect, a low-travel key mechanism includes a keycapassembly, a carrier structure comprising a plate and arms fixed toopposite ends of the plate, wherein each arm includes a plurality ofpivot pin retaining members, and a butterfly hinge comprising twoseparate wings positioned adjacent to each other, each wing comprising apair of pivot pins and a pair of keycap pins, wherein the pivot pins arecoupled to the carrier structure and the keycap pins are coupled to thekeycap assembly. The carrier structure can house an electronics packagethat includes circuitry such as a switch, light source, or a display.

In another aspect, a butterfly assembly can include first and secondwings, each wing comprising a pair of pivot pins and a pair of keycappins, wherein the pins of each pair are coaxially aligned with their ownrespective pair axis, first and second hinges that couple the first andsecond wings together, and a cavity is formed between the first andsecond wings when the wings are hinged together.

In yet another aspect, a key mechanism can include a keycap assembly, asupport structure, and a half-butterfly hinge. The half-butterfly hingeincludes two separate wings positioned adjacent to each other such thata cavity is formed between the two wings. Each wing includes a full ormajor arm and a minor arm that is shorter than the major arm. Each wingincludes a pair of pivot pins that couple to the support structure and apair of keycap pins that couple to the keycap assembly. A couplingmechanism couples the major arms of the half-butterfly hinge together.The coupling mechanism can be, for example, a flexible or living hingeor a gear hinge.

In another aspect, a switch includes an upper conductive structureattached to a substrate, and a lower conductive structure disposed underthe upper conductive structure and attached to the substrate. The upperand lower conductive structures can be conductive deformable structures.The switch is closed when the upper conductive structure contacts thelower conductive structure.

In another aspect, a toggle switch includes first and second wings andfirst and second hinges that couple the first and second wings together.A cavity is formed between the first and second wings when the wings arehinged together. A first switch positioned under the first wing and asecond switch positioned under the second wing.

In yet another aspect, a method for producing a glyph for a top surfaceof a keycap can include bonding a foil layer to an underlying firstlayer and forming an opening in the foil layer. The foil layer can havea thickness that is less than 100 microns. For example, the thickness ofthe foil layer is approximately 50 microns in some embodiments. Theopening is then filled with material in the underlying first layer toproduce the glyph. The opening can be filled by applying heat and/orpressure to the underlying first layer. The underlying first layer canbe, for example, a thermoplastic layer.

In another aspect, another method for producing a glyph for a topsurface of a keycap can include bonding a top liner layer to a bottomfoil layer and forming an opening in the foil layer. The foil layer canhave a thickness that is less than 100 microns. For example, thethickness of the foil layer is approximately 50 microns in someembodiments. The opening is then filled with a material to produce theglyph and the top liner layer is removed. The opening can be filled witha liquid or ink.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects and advantages of the invention will becomemore apparent upon consideration of the following detailed description,taken in conjunction with accompanying drawings, in which like referencecharacters refer to like parts throughout, and in which:

FIG. 1 shows a perspective view of a computing device having a keyboardincorporated therein in accordance with an embodiment;

FIG. 2 shows an illustrative perspective view of a section of a keyboardin accordance with an embodiment;

FIG. 3 shows a generic and illustrative exploded view of a key mechanismin accordance with an embodiment;

FIGS. 4A-4B show respective illustrative partial cross-sectional viewsof a key mechanism in a non-depressed position and depressed position inaccordance with an embodiment;

FIGS. 5A-5C show illustrative views of butterfly hinge in accordancewith an embodiment;

FIG. 6 shows illustrative top view of a key mechanism in accordance withan embodiment;

FIG. 7 shows an illustrative exploded view of the key mechanism of FIG.6 in accordance with an embodiment;

FIG. 8 shows an illustrative perspective view of a keycap assembly inaccordance with an embodiment;

FIG. 9 shows an illustrative perspective view of an electronics packagein accordance with an embodiment;

FIG. 10 shows an illustrative perspective view of keycap assembly andelectronics package in accordance with an embodiment;

FIG. 11 shows an illustrative top view of a butterfly hinge inaccordance with an embodiment;

FIG. 12 shows an illustrative top view of a support structure inaccordance with an embodiment;

FIG. 13 shows an illustrative top view of a butterfly hinge coupled tosupport structure in accordance with an embodiment;

FIG. 14A shows an illustrative top view of an alternative supportstructure in accordance with an embodiment;

FIG. 14B shows an illustrative top view of a yet another alternativesupport structure in accordance with an embodiment;

FIGS. 15-16 show illustrative cross-sectional views of a key mechanismin accordance with an embodiment;

FIG. 17 shows an illustrative perspective view of another key mechanismin accordance with an embodiment;

FIG. 18 shows an illustrative cross-sectional view of the key mechanismof FIG. 17 in accordance with an embodiment;

FIG. 19 shows an illustrative perspective view of a butterfly hinge andsupport structure in accordance with an embodiment;

FIG. 20 shows an illustrative exploded view of a key mechanism inaccordance with an embodiment;

FIG. 21 shows an illustrative top view of a butterfly hinge inaccordance with an embodiment;

FIG. 22 shows an illustrative top view of a butterfly hinge coupled to acarrier structure in accordance with an embodiment;

FIG. 23 shows an illustrative bottom view of a butterfly hinge coupledto a carrier structure in accordance with an embodiment;

FIG. 24 shows an illustrative perspective view of a key mechanism inaccordance with an embodiment;

FIG. 25 shows an illustrative cross-sectional view of key mechanism inaccordance to an embodiment;

FIG. 26 shows an illustrative perspective view of a key mechanism inaccordance with an embodiment;

FIG. 27 shows an illustrative cross-sectional view of key mechanism inaccordance to an embodiment;

FIG. 28 shows an illustrative perspective view of carrier structurecoupled to a support structure in accordance with an embodiment;

FIGS. 29A-29B show illustrative views of a butterfly hinge in accordancewith an embodiment;

FIGS. 30A-30C show illustrative views of a butterfly hinge in accordancewith an embodiment;

FIGS. 31A-31C show illustrative views of a butterfly hinge in accordancewith an embodiment;

FIGS. 32A-32C show illustrative views of a butterfly hinge in accordancewith an embodiment;

FIGS. 33A-33B show illustrative views of a butterfly hinge in accordancewith an embodiment;

FIG. 34 shows an illustrative exploded view of a key mechanism inaccordance with an embodiment;

FIGS. 35A-35B show respective illustrative cross-sectional views of thekey mechanism of FIG. 34 in a non-depressed position and depressedposition in accordance with an embodiment;

FIGS. 36-39 show various illustrative bottom views of a keycap assemblyin accordance with an embodiment;

FIG. 40 shows an illustrative view of a half-butterfly hinge inaccordance with an embodiment;

FIG. 41 shows an illustrative bottom view of a key mechanism with ahalf-butterfly hinge in accordance with an embodiment;

FIG. 42 is an illustrative perspective view of a switch in accordancewith an embodiment;

FIGS. 43-44 show illustrative cross-sectional views of switch of FIG. 42in accordance with an embodiment;

FIGS. 45-49 show various illustrative bottom views of a keycap assemblyin accordance with an embodiment;

FIGS. 50-52 show various illustrative cross-sectional views of a keycapassembly and a substructure in accordance with an embodiment;

FIG. 53 shows an illustrative top view of a key mechanism in accordancewith an embodiment;

FIG. 54 shows an illustrative cross-sectional view of keycap assembly ofFIG. 53 in accordance with an embodiment;

FIGS. 55-57 show illustrative perspective views of a method for forminga keycap in accordance with an embodiment; and

FIGS. 58-61 show illustrative perspective views of another method forforming a keycap in accordance with an embodiment.

DETAILED DESCRIPTION

Some embodiments described herein provide a key mechanism for an inputdevice such as a keyboard that includes a butterfly hinge. The butterflyhinged key mechanism can enable substantially low travel distances withdesired tactile response. For example, a butterfly hinged key mechanismcan enable keystrokes ranging between 0.1 mm to 2.0 mm, and in someembodiments, the keystroke can be 0.5 mm or 0.75 mm. The key mechanismuses a double wing design operative to move between a depressed positionand non-depressed position. Corresponding arms of the butterfly hingeare coupled together with coupling mechanisms. The coupling mechanismscan be, for example, a flexible or living hinge or a gear hinge. Thewings of the butterfly hinge articulate independently with each wingoperative to pivot about its own pivot axis during a keystroke of thekey mechanism.

Other embodiments described herein provide a key mechanism for an inputdevice such as a keyboard that includes a half-butterfly hinge. Thehalf-butterfly hinged key mechanism can enable similar low traveldistances with desired tactile response in a smaller space. One arm ofeach wing is a full or major arm while the other arm is a shorter orminor arm. The two major arms are coupled together with a couplingmechanism. The coupling mechanism can be, for example, a flexible orliving hinge or a gear hinge. The two minor arms are not coupled to eachother but can be coupled to a component in the key mechanism, such as aswitch housing. The wings of the half-butterfly hinge articulateindependently with each wing operative to pivot about its own pivot axisduring a keystroke of the key mechanism.

Various substructures are described herein that provide support to akeycap of a key mechanism. Additional support devices, such as rods orstiffener plates can be included in a key mechanism to provide supportand/or to transfer an applied force across or over a key mechanismduring a keystroke event.

Methods for producing a keycap or a top surface of a keycap aredisclosed. One method bonds a first layer to a second layer and forms anopening through the first layer to expose the second layer. The firstlayer can be a foil layer, such as an aluminum foil layer. The firstlayer can have a thickness that is less than 100 microns. In someembodiments, the foil layer has a thickness of approximately 50 microns.The second layer can be a resin or thermoplastic layer. The opening canbe in the shape of one or more glyphs that will be visible on the topsurface of the keycap. Once the opening is formed in the first layer,pressure and/or heat is applied to the layers to cause the second layerto flow into the opening and produce the desired glyph or glyphs.

Another method bonds a first top layer and a second bottom layertogether and forms an opening in the second bottom layer to expose thefirst top layer. The second bottom layer can be a foil layer, such as analuminum foil layer. The first layer can have a thickness that is lessthan 100 microns. In some embodiments, the foil layer has a thickness ofapproximately 50 microns. The first top layer can be a liner layer. Theopening can be in the shape of one or more glyphs that will be visibleon the top surface of the keycap. Once the opening is formed in thesecond bottom layer, the opening is filled with a material to producethe desired glyph or glyphs. The opening can be filled, for example,using a liquid or ink.

FIG. 1 shows a perspective view of a computing device 10 having akeyboard 12 incorporated therein. Computing device 10 can be anysuitable computing device, such as, for example, a laptop computer, adesktop computer, a telephone, smart phone, or gaming device. Keyboard12 can be integrally formed within computing device 10. In otherembodiments, a keyboard according to an embodiment can be separate fromthe computing device and can stand alone as a self-contained device. Forexample, a keyboard may be a communication interface such as, forexample, a wired keyboard or a wireless keyboard that can transmit datato and from a computing device.

FIG. 2 shows an illustrative perspective view of a section of keyboard12 including a key 14. FIG. 2 also shows a stackup of web 30 and supportstructure 70. Web 30 can be a skeletal structure that surrounds each keyof keyboard 12 and provides structural and cosmetic attributes tokeyboard 12. Web 30 can be secured to support structure 70 using anysuitable approach such as, for example, by adhesive, glue, weld, pins,interface fits, or any combination thereof. Support structure 70 canprovide the platform for components contained within a keyboard. Supportstructure 70 is sometimes referred to as a feature plate. As definedherein, support structure 70 can include any combination of a featureplate, circuit board, and retaining mechanisms for use in variouskeyboard mechanism embodiments.

Key mechanisms according to various embodiments discussed herein providea substantially low travel keystroke while maintaining a desired tactilefeel over the lifetime of the keyboard. Decreasing the keystrokedistance enables keyboard 12 to be built thinner than contemporarykeyboards. For example, key mechanisms according to various embodimentsdescribed herein can enable keystrokes ranging between 0.1 mm to 2.0 mm,and in some particular embodiments, the keystroke can be 0.5 mm or 0.75mm.

The tactile performance of the key mechanism is consistent regardless ofwhere a user presses down on key 14. That is, the tactile response ofkey 14 is substantially the same if the user pressed down at the center(at region 15 a), the corner (at region 15 b), or the edge (at region 15c) of key 14. In addition to having a uniform tactile response, themovement of key 14 during a keystroke is also uniform regardless ofwhere it is depressed. For example, imagine a reference plane exists atthe top surface of key 14. When key 14 is pressed at region 15 a, itsmovement is one in which the top planer surface of key 14 remainsparallel to the reference plane throughout the keystroke. The same istrue when key 14 is depressed at a corner or edge; the top planersurface remains parallel or substantially parallel to the referenceplane throughout the keystroke. Maintaining this parallel movement, witha relatively low travel, and desired tactile response, is accomplishedusing a butterfly hinge mechanism according to various embodiments.

Referring now to FIG. 3, a generic and illustrative exploded view of keymechanism 12 is shown. Reference will also be made to FIGS. 4-5 toassist in the description of how key mechanism 12 operates. Keymechanism 12 can include keycap 14, substructure 20, web 30, switch 40,butterfly hinge 50, and support structure 70. Assembly of key mechanismis as follows. Keycap 14 is secured to substructure 20 to form a keycapassembly. The keycap assembly can fit within the inner perimeter of web30, and web 30 is secured to an outer boundary of support structure 70.In other embodiments, the keycap assembly can exist above web 30.Butterfly hinge 50 is secured to substructure 20 and support structure70, and is also contained within the inner perimeter of web 30. Switch40 resides within cavity 53 of butterfly hinge 50 and can be secured toeither the keycap assembly or support structure 70.

Keycap 14 is the portion of key mechanism that a user depresses during akeystroke. Keycap 14 can take any suitable shape and can be constructedfrom any suitable material. For example, keycap 14 can be constructedfrom plastic, glass, or metal. In some embodiments, keycap 14 can beconstructed from a translucent material so that a backlight can shinethrough. Moreover, a translucent keycap can be masked so that itdisplays a character.

Substructure 20 can take any suitable shape and be constructed from anysuitable material. Substructure 20 can fulfill several differentfunctions in its use in key mechanism. In one function, it provides pinretaining mechanisms 22 for coupling to butterfly hinge 50. Inparticular, substructure can include four pin retaining mechanisms 22,each one operative to couple to one of keycap assembly pins 54 and 57 ofbutterfly hinge 50. Additional details of pin retaining mechanisms 22are discussed in more detail below.

As another function, substructure 20 can serve as a light guide panel(hereinafter “LGP”) for distributing backlight emitted from a lightsource such as, for example, a LED. In embodiments that use substructure20 as a LGP, the shape of substructure 20 can be designed to minimizethe impact of backlighting performance. For example, substructure 20 canoccupy an outer periphery of keycap 14, thereby leaving an interiorportion of keycap largely unobfuscated. The use of a LGP as part ofsubstructure 20 is discussed in more detail below.

The combination of keycap 14 and substructure 20 (and potentially othercomponents such as switch 40, electronics (not shown), and flexcircuitry (not shown)) is sometimes referred to herein as a keycapassembly. In some embodiments, depending on the stiffness of keycap 14,a relatively strong substructure is needed to provide the rigidityneeded for property operation of key mechanism 12. For example, ifkeycap 14 is constructed from a plastic, substructure 20 may beconstructed from metal. In other embodiments, keycap 14 can beconstructed from a relatively stiff material such as glass andsubstructure can be constructed from a plastic or metal material. In yetanother embodiment, keycap 14 and substructure 20 can be an integrallyformed keycap assembly. For example, keycap 14 and substructure 20 canbe formed from a single plastic mold or a single piece of machinedglass.

Switch 40 can be any suitable mechanical switch such as a dome switch. Ametal dome switch or an elastomeric dome switch may be used, forexample. As will be explained more detail in connection with FIG. 4,switch 40 can bias the keycap assembly to be in its natural,non-depressed position. In other words, when key mechanism is notundergoing a keystroke event, switch 40 can bias the keycap assembly tobe in its non-depressed position. When key mechanism 12 is subjected toa keystroke event, switch 40 can buckle under the force applied tokeycap 14, thereby enabling the keycap assembly to be in its depressedposition. When the keycap assembly is in its depressed position, thekeystroke can be registered by circuitry associated with switch 40 or byother circuitry contained within key mechanism (e.g., a parallel platesensor membrane).

Butterfly hinge 50 functions as the movable hinge that enables thekeycap assembly to move relative to support structure 70. Butterflyhinge 50 can include wings 51 and 52, which are separate componentscoupled together by coupling mechanisms 60. Wing 51 includes keycapassembly pins 54 and pivot pins 55, and wing 52 includes keycap assemblypins 57 and pivot pins 56. Wings 51 and 52 may each include a cutoutsuch that when wings 51 and 52 are coupled together, cavity 53 exists.Cavity 53 can have any suitable shape such as, for example, a square, arectangle, circle, or ellipse.

Keycap assembly pins 54 and 57 are coupled to pin retaining mechanisms22 a, 22 b of substructure 20. Pivot pins 55 and 56 are coupled to pivotpin retaining mechanisms 75 and 76, respectively, of support structure70. The manner in which pins are coupled to substructure 20 and supportstructure 70 vary depending on specific embodiments, discussed below.

Coupling mechanisms 60, though coupling wings 51 and 52 together, mayenable wings 51 and 52 to move independent of each other. Thus, if onewing were locked in a position, the other wing would be free to move,and vice versa. However, as will be explained in FIGS. 4-5, wings 51 and52 are both secured to support structure 70 and are operative to move(or flap) in concert with each other, with coupling mechanism 60changing between substantially flat-shaped and v-shaped positions. Manydifferent embodiments of coupling mechanisms 60 can be used withbutterfly hinge 50. These embodiments are discussed in more detail inconnection with the description below accompanying FIGS. 4-5. In otherembodiments, coupling hinges 60 can be omitted from butterfly hinge 50.

Support structure 70 can be constructed from any suitable material orcombination of different materials. The specific construction andmaterials used depends on particular key mechanism embodiment beingemployed, and thus these notable features are discussed in more detailbelow. One notable feature of structure 70 shown in FIG. 3 is cutouts77. Cutouts 77 are positioned in predetermined positions on structure 70so that pin retaining mechanism 22 of substructure 20 can fit into arespective cutout when the key mechanism is in its depressed position.This nestling of components within each other during a keystroke helpskey mechanism 12 maintain its relatively thin z-height.

Referring now to FIGS. 4A-4B, illustrative partial cross-sectional viewsof key mechanism 12 are shown in a non-depressed position (FIG. 4A) anddepressed position (FIG. 4B). Both figures show keycap 14, pin retainingmechanism 22 a, 22 b of substructure 20, wing 51 with pivot pin 55 andkeycap assembly pin 54, wing 52 with pivot pin 56 and keycap assemblypin 57, coupling member 60, switch 40, support structure 70, and pivotpin retaining mechanisms 75 and 76. Other components of key mechanism 12have been omitted to provide less cluttered figures and to promote easeof discussion.

FIGS. 4A-4B also show keycap plane 400, pivot pin plane 410, andstructure plane 420. Regardless of whether key mechanism 12 is in itsdepressed or non-depressed state, the position of pivot pin plane 410and structure plane 420 remain fixed, as indicated by the set of doublearrows demarcating the z-height (shown as Zfixed) between the two planesin both figures. The z-height between keycap plane 400 and the structureplane 420, however, changes depending on the position of key mechanism12. In the depressed position, the z-height is Zdepressed, as shown, andin the non-depressed position, the z-height is Znon-depressed.

Pivot pin retaining mechanisms 75 and 76 are operative to securely holdpivot pins 55 and 56 in place, while enabling pivot pins 55 and 56 torotate within pivot pins retaining mechanisms 75 and 76. Keycap assemblypin 57 is coupled to pin retaining mechanism 22 a, which can securekeycap assembly pin 57 to substructure 20 (not shown) in a mannersimilar to how pivot pin retaining mechanisms 75 and 76 secure theirpins. Thus, pin retaining mechanism 22 a may rotate when keycap 14 isundergoing a keystroke. Keycap assembly pin 54 can be coupled to pinretaining mechanism 22 b, which is operative to enable keycap assemblypin 54 to slide horizontally within the pin retaining mechanism as keymechanism 12 travels up and down. Thus, the pin retaining system usesthree sets of pin retaining mechanisms (one set for each pair of pins57, 56, and 55) for securing rotating pins 57, 56, and 55 in place withminimal horizontal movement, and a fourth set (for pins 54) for securingsliding pins 54 in place with a fixed amount of horizontal movement.Additional aspects and features on the retaining mechanisms arediscussed in more detail below for various different embodiments.

Referring collectively now to FIGS. 4A-4B and FIGS. 5A-5C, wings 51 andwings 52 pivot about their own respective pivot axes. Wing 51 pivotsabout axis 510, which runs co-axially with the center axis of pivot pins55, and wing 52 pivots about axis 520, which runs co-axially with thecenter axis of pivot pins 56. Since pivot pins 55 and 56 are secured inposition with respect to structure 70 (as shown by fixed z-heightZfixed), it is the outer portions of wings 51 and 52 (particularly atkeycap assembly pins 54 and 57) that move relative to pivot pins 55 and56.

In the non-depressed position, switch 40 is in its natural unbuckledposition. In this position, switch 40 biases keycap 14 upwards when keymechanism 12 is not being subjected to a keystroke event. With theupward bias of switch 40, it pushes keycap 14 up, resulting in havingpin retaining mechanism 22 a, 22 b pull keycap assembly pins 54, 57 ofwings 51, 52 up. Since, pivot pins 55 and 56 are secured in place, wings51 and 52 pivot about their own respective pivot axes 510 and 520, andkeycap assembly pin 57 remains fixed in position, keycap assembly pin 54slides horizontally to the left (shown here as the −X direction) withinpin retaining mechanism 22 b. As shown, in the non-depressed position,wings 51 and 52 resemble a v-shaped hinge, with its outer portions(e.g., pin regions 57 and 54) raised relative to pin plane 410.

In the depressed position, switch 40 is buckled, and keycap 14 has moveddown vertically, thereby pushing the outer portions of wings 51 and 52down towards support structure 70. Pins 57, 56, and 55 are secured inplace and rotate within their secured positions, whereas keycap assemblypin 54 slides horizontally within its retaining mechanism in the +Xdirection. As shown in FIGS. 4A-4B, the relative position of keycapassembly pin 54 moves to the +X direction when the key mechanism 12 isin the depressed position. Moreover, in the depressed position, wings 51and 52 resemble a log shaped hinge, with all pins 54-57 in substantiallythe same plane.

Use of the butterfly hinge 50 in key mechanism 12 provides not only alow travel keystroke, but a stable key mechanism. The double wing designof butterfly hinge 50 distributes loading evenly with respect to thekeycap assembly. The evenly distributed loading is accomplished byplacing the load bearing keycap assembly pins 57 and 54 at the outerportions of wings 51 and 52, respectively. This stable loading istranslated to keycap 14 because regardless of where a user presses downon keycap 14, the load will be distributed across the key, resulting ina tactically desirable and non-wavering keystroke.

Referring now to FIGS. 6-16, a low travel key mechanism according to anembodiment is discussed. Features discussed above in connection withFIGS. 2-5 apply to similar features discussed in connection with FIGS.6-16, however, notable features will be discussed in more detail. FIG. 6shows an illustrative top view of key mechanism 612, showing keycap 614and a few internal features shown by solid lines, although thecomponents may be hidden. In particular, substructure 620 (withintegrated light guide panel) and LED 648 are shown by solid line, butmay be hidden by keycap 614.

FIG. 7 shows an illustrative exploded view of key mechanism 612. Asshown, key mechanism 612 can include keycap 614, substructure 620, web630, electronic package 642, butterfly hinge 650, support structure 670,and cover plate 680. Support structure 670 includes pivot pin retainingmembers 675 and 676. Cover plate 680 can be a printed circuit board or aheat spreader. FIG. 8 shows an illustrative perspective view of thebottom of keycap 614 and substructure 620, with substructure 620 securedto keycap 614. In this embodiment, substructure 620 doubles as a pinretaining structure and a LGP. The LGP aspect of substructure 620 isevident in that it occupies a majority of the surface area of keycap 614and includes notch 624 for enabling a light source, such as LED 648, tofit adjacent to the LGP.

As shown, substructure 620 has pin retaining mechanisms 622 a and 622 blocated near the corners of keycap 614. Pin retaining mechanisms 622 aare operative to securely couple pins and allow the pins to rotatefreely within. In particular, pin retaining mechanisms 622 a can bec-clip retaining members. Pin retaining mechanisms 622 b are operativeto slidably couple pins therein. That is, the pins are retained withinthe mechanism, but are allowed to slide horizontally within themechanism when the key mechanism is undergoing a keystroke event. Pinretaining mechanism 622 b can have an extruded L-shape that extends aminimum distance sufficient to contain the sliding pin. Note that bothpin retaining mechanisms 622 b may face each other. It is understoodthat any suitable number of different configurations of pin retainingmechanisms 622 b can be used to achieve the desired coupling effect.

FIG. 9 shows an illustrative perspective bottom view of electronicspackage 642. Electronics package can include switch 640, which ismounted to flexible printed circuit board (PCB) 643, connector portion644, support portion 645, and LED 648. In other embodiments, electronicspackage 642 can include a display such as OLED display. Referring toboth FIGS. 9 and 10, electronics package 642 is mounted to substructure620. In this arrangement, the base of switch 640 is pressed againstsubstructure 620, and LED 648 fits within notch 624 (FIG. 8). Supportportion 645 floats relative to PCB 643 via connector portion 644 andsurrounds keycap 614 and substructure 620. Thus, when key mechanism 612is assembled, the nipple side of switch 640 faces downward towardssupport structure 670 (not shown), and passes through cavity 653 ofbutterfly hinge 650 (shown in FIG. 11). In addition, when assembled,support portion 645 can align with web 630 (FIG. 7) and both web 630 andsupport portion 645 can be secured to support structure 670 (FIG. 7).

FIG. 11 shows an illustrative top view of butterfly hinge 650. Butterflyhinge 650 includes wings 651 and 652. No coupling mechanisms are showncoupling wings 651 and 652 together in this detailed view. Wing 651 caninclude pivot pins 656, keycap assembly pins 657, and upstop members658. Wing 652 can include pivot pins 655, keycap assembly pins 654, andupstop members 659. Both wings 651 and 652 are shaped so that cavity 653exists when the wings are placed adjacent to one another. Pivot pins 655and 656 and upstop members 658 and 659 extend away from the outsidesurface of butterfly hinge 650, whereas keycap assembly pins 654 and 657extend within butterfly hinge 650. Pivot pins 655 and upstop members 659may be coplanar with each other and extend about the same distance awayfrom butterfly hinge 650. Similarly, pivot pins 656 and upstop members658 may be coplanar with each other and extend about the same distanceaway from butterfly hinge 650.

FIG. 12 shows an illustrative top view of support structure 670. Supportstructure 670 has pivot pin retaining members 675 and 676, and upstops678 and 679. Pivot pin retaining members 675 and 676 are operative tosecure pivot pins 655 and 656, respectively, in place but enable thepins to rotate freely within. Pivot pin retaining members 675 and 676may be c-clip types of retaining members. Upstops 678 and 679 may behook shaped members operative to engage upstop members 658 and 659,respectively. Upstops 678 and 679 ensure that wings 651 and 652 do nottravel up beyond a pre-determined vertical distance when key mechanismis in its natural, un-depressed position. Support structure 670 can alsoinclude cutouts 677.

FIG. 13 shows an illustrative top view of butterfly hinge 650 coupled tosupport structure 670. In this view, pivot pins 655 and 656 are securedto support structure 670 via pivot pin retaining members 675 and 676,respectively, and upstop members 658 and 659 are positioned underupstops 678 and 679, respectively. FIG. 13 also shows how end portions(centered around keycap assembly pins 654 and 657) are positioned overcutouts 677. FIG. 15 shows an illustrative cross-sectional view of keymechanism 612, showing the interaction of pivot pins 655 and 656 withpivot pin retaining members 675 and 676 and, upstop members 658 and 659with upstops 678 and 679.

FIGS. 14A-14B show perspective views of alternative support structuresaccording to various embodiments. In particular, FIG. 14A shows adifferent retaining member configuration for securing butterfly hinge650 to support structure 1400. Support structure 1400 includes c-clipretaining members 1422, and hook retaining members 1432 for retainingpins of a butterfly hinge (not shown). Structure 1400 also includesupstop members 1440.

FIG. 14B shows support structure 1450 that includes pivot pin retainingmember 1462 and upstop members 1470. Pivot pin retaining member 1462 isa one piece construction including two circular eyes for holding pivotpins. Pivot pin retaining member 1462 can have a spring loaded bias topress against the butterfly hinge when its pivot pins are secured withinthe eyes.

FIG. 16 shows another illustrative cross-sectional view of key mechanism612 in a non-depressed position. This view shows switch 640 in anon-buckled position, wings 651 and 652 in a v-shaped arrangement, pinretaining mechanisms 622 a, 622 b, keycap assembly pins 657 and 654, andother components.

FIGS. 17-19 show various illustrative views of another key mechanismaccording to an embodiment. In particular, FIG. 17 shows an illustrativeperspective view of key mechanism 1712 in a non-depressed position. FIG.18 shows a cross-sectional view taken along line 18-18 in FIG. 17. AndFIG. 19 shows an illustrative perspective view of key mechanism withouta keycap assembly. Key mechanism 1712 exhibits many of the sameattributes of the generic key mechanism of FIGS. 2-5, but includes moredetails regarding its hinge and support structure. As shown in FIG. 17,key mechanism 1712 can include keycap 1714, laminate layer 1716,substructure 1720, switch 1740, butterfly hinge 1750, and supportstructure 1770.

Butterfly hinge 1750 can include wings 1751 and 1752. Wing 1751 caninclude pivot pins 1755 and keycap assembly pins 1754. Wing 1752 caninclude pivot pins 1756 and keycap assembly pins 1757. Keycap assemblypins 1754 and 1757 are coupled to substructure 1720, and pivot pins 1755and 1756 are coupled to support structure 1770. Pivot pins 1755 and 1756are secured within slots 1775 and 1776 of support structure 1770. Slots1775 and 1776 may be cavities in the structure 1770 that are covered bylaminate material 1716. In some embodiments, laminate material 1716 canbe the same as a web (such as web 30). In effect, laminate material 1716locks pivot pins 1755 and 1756 in place within support structure 1770.In this embodiment, pivot pins 1755, 1756 and keycap assembly pins 1754,1757 all extend away from butterfly hinge 1750.

Switch 1740 can fit in a cavity existing between wings 1751 and 1752, asshown. In this particular embodiment, the base of switch 1740 can resideon support structure 1770, as opposed to being fixed to substructure1720. When key mechanism 1712 is in its non-depressed position, switch1740 is in its unbuckled state and props or biases the keycap assemblyup. When key mechanism 1712 is in its depressed position, switch 1740will be buckled and wings 1751 and 1752 will be pressed down in a logshaped position, with all pins 1754, 1755, 1756, 1757 in substantiallythe same plane.

Each wing can include upstops 1910, which are operative to limit theup-travel of the wings when the key mechanism is in its undepressedposition. Upstops 1910 may engage laminate layer 1716 in the undepressedposition. Upstops 1910 may be shaped at an angle to enable flushinterfacing with the laminate layer.

FIGS. 20-28 show various illustrations of a key mechanism 2012 using acarrier plate according to an embodiment. References to key mechanism2012 include all FIGS. 20-28, with occasional specific reference toindividual figures. The carrier plate, as opposed to the structuralsupport is responsible for securing the pivot pins of the butterflyhinge in place. In addition, the carrier plate can also support anelectronic package. Referring now to FIG. 20, there is shown an explodedview of key mechanism 2012. Key mechanism 2012 can include keycap 2014,substructure 2020, carrier plate 2090, electronics package 2042, switch2040, butterfly hinge 2050, web 2030, and circuit board 2080. Componentsdiscussed earlier in connection with FIGS. 2-5 may share characteristicswith similar components of key mechanism 2012. For example, keycap 2014and substructure 2020 and its interaction with keycap assembly pins ofbutterfly hinge 2050 is similar to how keycap 14 and substructure 20interact with butterfly hinge 50.

Carrier plate 2090 is constructed to fit within cavity 2053 (FIG. 21) ofbutterfly hinge 2050 and be secured to circuit board 2080. Carrier plate2090 can be secured to circuit board 2080 in any number of suitabledifferent ways. For example, it can be glued or welded to circuit board2080. As another example, carrier plate 2090 can have several posts thatextend from a bottom surface of the carrier plate and engage withcorresponding cavities in circuit board 2080. As yet another example,carrier plate 2090 can be secured in place with two or more clips 2802,as shown in FIG. 28. When carrier plate 2090 is secured to circuit board2080, it secures pivot pins 2056 and 2055 in place so that they are freeto rotate in place within pivot pin retaining members 2095 and 2096. Thepin arrangement of butterfly hinge 2050 is shown in more detail in FIG.21, and the pivot pin retaining members of carrier plate 2090 is shownin more detail in FIGS. 22, 23, 24, and 25.

Butterfly hinge 2050 can include two wings 2051, 2052 connected togetherusing a coupling mechanism (not shown). Any suitable coupling mechanismcan be used. Various examples of such coupling mechanism are describedin more detail below. Cavity 2053 can exist between the two wings 2051,2052 when placed adjacent to each other.

Carrier plate 2090 can be constructed from any suitable material such asmetal or plastic. The construction of carrier plate 2090 can include aflat plate 2091, which is flanked by two raised arm members 2092. Eachraised arm member 2092 can include pivot pin retaining member 2095 andpivot pin retaining member 2096. In addition, each raised arm member2092 can include two upstop protrusions 2099. Upstop protrusions 2099are operative to engage upstops 2059 of butterfly hinge 2050 when keymechanism 2012 is in its non-depressed position. Protrusions 2099prevent wings 2051, 2052 of butterfly hinge 2050 from traveling beyond afixed vertical up direction.

Flat plate 2091 can serve as a platform for electronics package 2042,which can include among other features, switch 2040, LED, light guidepanel, display, and/or flex circuitry. This arrangement promotes easyconnections between circuit board 2080 and electronics package 2042because carrier plate 2090 is directly connected to circuit board 2080.This is in contrast to the flex printed circuit board embodimentassociated with key mechanism 612 (described earlier). Moreover, asshown in this embodiment, switch 2040 is mounted such that its dome isfacing substructure 2020 and keycap 2014. Thus, when switch 2040 is inits unbuckled position, it is operative to bias keycap 2014 andsubstructure 2020 upwards.

Referring now to FIGS. 26 and 27, there are shown pin retainingmechanisms 2022 a, 2022 b of substructure 2020 interfacing with keycapassembly pins 2054 and 2057. In particular, FIG. 27 shows the differentpin retaining mechanisms, pin retaining mechanism 2022 a for securingkeycap assembly pin 2054 in place so that it rotates in place, and pinretaining mechanism 2022 b for enabling keycap assembly pin 2057 toslide horizontally when key mechanism 2012 is being depressed.

FIGS. 29-33 show several different butterfly hinge embodiments that canbe used in conjunction with a key mechanism. Each of the embodimentsdiscussed in connection with FIGS. 29-33 include two wings that arecoupled together with a coupling mechanism. The nature of the couplingmechanism varies and can include two general types: living hinge andgear hinge. A living hinge coupling mechanism can be a flexible materialor combination of materials that physically attaches the two wingstogether. A gear hinge is a coupling mechanism built into the wingsthemselves that allows for a gear-like interaction between the wings.

FIGS. 29A-29B show illustrative top and partial perspective views ofbutterfly hinge 2900 in accordance with an embodiment. Hinge 2900includes wings 2910 and 2920 coupled together with living hinge 2930.Wings 2910 and 2920 can include pins as shown and can be made, forexample, from a glass-filled plastic. Living hinge 2930 can be made froma plastic material that is softer than the material used to make thewings. Wings 2910 and 2920 also include self-locking structures 2912 and2922.

Butterfly hinge 2900 can be manufactured using a double-shot process,wherein the first shot creates wings 2910 and 2920, and the second shotforms living hinge 2930. When the second shot is applied, it self-locksitself to self-locking structures 2912 and 2922 to couple wings 2910 and2920 together. Note that the thickness of living hinge 2930 issubstantially thinner at center axis 2940 of butterfly hinge 2900 thanat other portions of living hinge 2930. The thinner section at thejunction between wings 2910 and 2920 can promote ease of flexing betweenwings 2910 and 2920.

FIGS. 30A-30B show illustrative top and perspective views of butterflyhinge 3000 in accordance with an embodiment. Butterfly hinge 3000 can bemanufactured by insert molding wings 3010 and 3020 around living hinge3030. Molded wings 3010 and 3020 can include the pins, as shown. Livinghinges 3030 can be part of a metal strip 3050 containing several livinghinges 3030 (as shown in FIG. 30C). Including several living hinges 3030on a single strip can increase manufacturing throughput of butterflyhinge 3000. After wings 3010 and 3020 are molded on to strip 3050, thestrip can be cut away to yield an individual butterfly hinge 3000 thatis suitable for use in a key mechanism. Wings 3010 and 3020 can beconstructed, for example, with a plastic such as a glass filled plastic.

Living hinge 3030 can be a relatively thin piece of metal (e.g., steel)that is operative to bend to enable wings 3010 and 3020 to move whenused in a key mechanism. Living hinge 3030 can include retentionfeatures 3012 and 3014 to promote adhesion to the wings when the wingsare molded thereto. When wings 3010 and 3020 are molded onto strip 3050,shutoffs can be used to prevent wings from completely covering livinghinge 3030, thereby leaving a portion of living hinge 3030 exposed.

FIGS. 31A-31C show various views of butterfly hinge 3100 in accordancewith an embodiment. Butterfly hinge 3100 can be constructed by couplingmetal wings 3110 and 3120 together with an injection molded living hinge3130. Wings 3110 and 3120 can be constructed from a die cast or forgedmetal. In one embodiment, wings can be formed from a zinc die cast. Inthis embodiment, the pins are also formed in the die cast or forgedmetal. Wings 3110 and 3120 can be constructed to have retention features3112 and 3122 to assist living hinge 3130 retention. Living hinge 3130can be any suitable compliant material capable of bending. For example,living hinge 3130 can be constructed from a plastic or rubber material.

FIGS. 32A-32C show illustrative views of butterfly hinge 3200 inaccordance with an embodiment. Butterfly hinge 3200 can be constructedfrom two metal cores 3201 and 3202 (shown by hidden lines) that areovermolded with a molding material. The molding material fullyencapsulates metal cores 3201 and 3202 to form wings 3210 and 3220,which each include pins formed by the overmold, and living hinge 3230.Cores 3201 and 3202 can be separate metal components with retentionfeatures 3205 incorporated therein. Retention features 3205 can enablethe injected molded material to self-lock itself to cores 3201 and 3202.

Living hinge 3230 can be formed from the overmold that couples cores3201 and 3202 together. It can be sized to be relatively narrow at thejunction between wings 3210 and 3220 to promote ease of movement. Hinge3200 can be constructed in batch fashion in that strip 3250 can containseveral cores. The cores can be overmolded and then die cut to yieldeach butterfly hinge 3200.

In another embodiment (not shown), a butterfly hinge can be constructedfrom two metal cores, having forged or die cast pins, that are at leastpartially overmolded with a molding material, but in a way so that thepins are left exposed. This way, the metal pins are exposed and formedfrom metal, as opposed to an injection molded plastic. A living hinge isformed from the injection molded plastic coupling the two corestogether.

FIGS. 33A-33B show illustrative views of butterfly hinge 3300 inaccordance with an embodiment. Hinge 3300 includes wings 3310 and 3320that each include pins and upstops, as shown. Wing 3310 has gear members3315 and wing 3320 has gear members 3325. Gear members 3315, 3325interface with each other to form a gear hinge.

Referring to FIG. 33B, a close up of the gear hinge is shown. Inparticular the teeth of the gear members are shown. Wing 3310 has uppertooth 3315U and lower tooth 3315L, and wing 3320 has lower tooth 3325Land upper tooth 3235U. Upper tooth 3315U interfaces with lower tooth3325L and upper tooth 3325U interfaces with lower tooth 3315L. Thisupper/lower tooth configuration can promote coupling of wings 3310 and3320 when used in a key mechanism.

FIG. 34 shows an illustrative exploded view of a key mechanism inaccordance with an embodiment. Key mechanism 3412 can include keycap3414, substructure 3420, web 3430, butterfly hinge 3450, switch housing3459, membrane 3460 with switch 3440, and feature plate 3470. Componentsdiscussed previously in connection with FIGS. 2-5 may sharecharacteristics with similar components of key mechanism 3412. Forexample, keycap 3414 and substructure 3420 and its interaction withkeycap assembly pins 3454, 3457 of butterfly hinge 3450 is similar tohow keycap 14 and substructure 20 interact with butterfly hinge 50.

Butterfly hinge 3450 can include two wings 3451, 3452 connected togetherusing a coupling mechanism (not shown). Any suitable coupling mechanismcan be used. For example, living hinges or gear hinges can be used toconnect wings 3451, 3452 together. Cavity 3453 can exist between the twowings 3451, 3452 when placed adjacent to each other. Pivot pins 3455,3456 extend within cavity 3453 of butterfly hinge 3450, whereas keycapassembly pins 3454 and 3457 extend away from an outside surface ofbutterfly hinge 3450.

Switch housing 3459 is constructed to fit within cavity 3453 ofbutterfly hinge 3450 and be secured to feature plate 3470. Switchhousing 3459 can be secured to feature plate 3470 in any number ofsuitable different ways. For example, switch housing 3459 can be gluedor welded to feature plate 3470. As another example, heat staking can beused to secure switch housing 3459 to feature plate 3470 using studs3472. Alternatively, pins (not shown) on switch housing 3459 can couplewith studs 3472 (e.g., snap into studs).

Pivot pins 3455 and 3456 are secured to switch housing 3459 using pivotpin retaining members 3495 and 3496. Pivot pin retaining members 3495and 3496 can be cavities or openings formed through the sides of switchhousing 3459. Pivot pin retaining members 3495 secure pivot pins 3455 onwing 3451 and pivot pin retaining members 3496 secure pivot pins 3456 onwing 3452. Once secured, pivot pins 3455, 3456 are free to rotate inplace within pivot pin retaining members 3495, 3496.

The keycap assembly pins 3454 on wing 3451 couple to pin retainingmechanisms 3422 a of substructure 3420, and keycap assembly pins 3457 onwing 3452 couple to pin retaining mechanisms 3422 b of substructure3420.

Feature plate 3470 can be constructed from any suitable material such asmetal or plastic. Membrane 3460 can be secured to feature plate 3470,for example, with pressure sensitive adhesive 3465. Switch 3440 can beimplemented as a deformable or rubber dome switch in some embodiments.Switch 3440 is connected to membrane 3460, which can include thecircuitry for switch 3440. Switch 3440 can be connected to membrane 3460in any number of suitable different ways. For example, an adhesive layercan be used to secure switch 3440 membrane 3460. Switch 3440 isconfigured to fit into opening 3497 formed through the bottom surface ofswitch housing 3459. Moreover, as shown in this embodiment, switch 3440is mounted such that its dome is facing substructure 3420 and keycap3414. Thus, when switch 3440 is in its unbuckled position, it isoperative to bias keycap 3414 and substructure 3420 upwards.

Membrane 3460 includes openings 3461, 3462, 3463, and 3464 and PSA 3465includes openings 3466, 3467, 3468, and 3469. Feature plate 3470includes openings 3473 and 3474. Openings 3463, 3468, and 3473 andopenings 3464, 3469, and 3474 align with respective arms of the wings3451 and 3452 of butterfly hinge 3450. Openings 3461 and 3466 andopenings 3462 and 3467 align with the outer portions of respective wings3451 and 3452.

FIGS. 35A-35B show respective illustrative cross-sectional views of thekey mechanism of FIG. 34 in a non-depressed position and depressedposition in accordance with an embodiment. FIG. 35A shows switch 3440 ina non-buckled position, wings 3451 and 3452 in a v-shaped arrangement,pin retaining mechanisms 3422 a, 3422 b, keycap assembly pins 3457 and3454, and other components. In this position, switch 3440 can biaskeycap 3414 upwards.

In the depressed position shown in FIG. 35B, switch 3440 is buckled, andkeycap 3414 has moved down vertically, thereby pushing the outerportions of wings 3451 and 3452 down towards feature plate 3470. Keycapassembly pin 3454 is secured in place and rotated within its securedposition, whereas keycap assembly pin 3457 slides horizontally withinits retaining mechanism in the +X direction. As shown in FIGS. 35A-35B,the relative position of keycap assembly pin 3457 moves to the +Xdirection when the key mechanism 3412 is in the depressed position.Moreover, in the depressed position, wings 3451 and 3452 over-travelusing openings 3461, 3466 and 3462, 3467, respectively to resemble aslightly inverted “v”. In FIG. 35A, wings 3451 and 3452 are positionedto resemble a “v” shape, whereas in FIG. 35B wings 3451 and 3452 havemoved to a position that resembles a “∧” shape with the inner portionsof the wings 3451, 3452 moved upwards toward substructure 3420. Wings3451 and 3452 articulate up and nest against or within substructure3420. For example, a cavity can be formed in the bottom of substructure3420 for at least the portions of wings 3451 and 3452 connected togetherby coupling mechanisms. Nesting of the wings 3451, 3452 allows the keymechanism 3412 to travel or depress a greater distance.

Referring now to FIGS. 36-39, there are shown various illustrativebottom views of a keycap mechanism in accordance with an embodiment. Thebottom element of the keycap mechanism, such as a feature plate orcircuit board, is not shown in the figures for clarity. FIG. 36 depictsa square key mechanism that includes one switch (not shown; switch isattached to membrane 3660). For example, key mechanism 3612 can be usedfor an alphanumeric key mechanism, a page up and page down keymechanism, an arrow (< or >) key mechanism, and/or an end or home keymechanism in a keyboard. The key mechanism includes one butterfly hingeformed with wings 3651 and 3652 connected together by coupling mechanism3630. The switch in switch housing 3659 is disposed in the cavity formedby wings 3651 and 3652 of the butterfly hinge.

A rectangular key mechanism is illustrated in FIG. 37. Key mechanism3712 can be used, for example, for the tab, shift, enter, and/or thebackspace key mechanisms in a keyboard. Key mechanism 3712 includes abutterfly hinge formed with wings 3751 and 3752 coupled together bycoupling mechanism 3730. Switch housing 3759 is positioned in the cavityformed between the wings 3751 and 3752. Switch housing 3759 includes aswitch (not shown) secured to a membrane 3760. Retaining mechanisms 3750secure rods 3785 to wings 3751 and 3752. Rods 3785 can be formed withany suitable material, examples of which include steel and carbon rods.Rods 3785 extend substantially across the width of the outer portions ofwings 3751 and 3752. When keycap 3714 is depressed, rods 3785 transferthe force across the wings 3751 and 3752. Thus, if a user depresses keymechanism 3712 at or near an edge or corner of key mechanism 3712,keycap 3714 will substantially maintain its horizontal position as thekeycap travels downward, which can ensure the switch is depressedproperly.

FIG. 38 depicts a larger rectangular key mechanism. The largerrectangular key mechanism 3812 can be used, for example, for thespacebar key mechanism in a keyboard. Key mechanism 3812 includes twobutterfly hinges 3816 and 3818. Each butterfly hinge is formed withwings 3851 and 3852 coupled together by coupling mechanism 3830. Switchhousing 3859 is positioned between the two butterfly hinges 3816 and3818 and runs between wings 3851 and 3852 of butterfly hinges 3816 and3818. Near the center of key mechanism 3812, switch housing 3859includes a switch (not shown) secured to a membrane 3860. Retainingmechanisms 3850 secure rods 3885 to wings 3751 and 3752 of butterflyhinges 3816 and 3818. Rods 3785 extend substantially across the width ofthe outer portions of wings 3751 and 3752 and can transfer a depressingforce at or near an edge or corner of key mechanism 3812 over the widthof a respective butterfly hinge.

FIG. 39 illustrates another larger rectangular key mechanism. Keymechanism 3912 includes two butterfly hinges 3916 and 3918. Eachbutterfly hinge is formed with wings 3951 and 3952 coupled together bycoupling mechanism 3930. Switch housing 3859 is positioned between thetwo butterfly hinges 3816 and 3818. Stiffener plates 3970 are attachedto wings 3951 and stiffener plates 3980 are attached to wings 3952 ofbutterfly hinges 3916 and 3918. Stiffener plates 3970 and 3980 extendsubstantially across the width of the outer portions of wings 3951 and3952 and increase the stiffness of key mechanism 3912. LGP 3990 and 3995can be positioned at each end of key mechanism 3912.

Referring now to FIG. 40, there is shown an illustrative view of ahalf-butterfly hinge in accordance with an embodiment. FIG. 41 shows anillustrative bottom view of a key mechanism with a half-butterfly hingein accordance with an embodiment. The bottom element of the keycapmechanism 4112, such as a feature plate or circuit board, is not shownin the figures for clarity.

In some embodiments, a half-butterfly hinge can be included in keymechanisms having smaller keycaps. Other embodiments can include one ormore half-butterfly hinge in larger keycaps. Half-butterfly hinge 4050includes wing 4051 adjacent to wing 4052. One full or major arm of wing4051 is connected by coupling mechanism 4030 to a corresponding majorarm of wing 4052. The shorter or minor arms of wings 4051 and 4052 aresecured to switch housing 4059 at 4056 and 4058. The minor arms can beconnected to switch housing 4059 by any suitable means. For example, apivot pin (not shown) can extend out from the inner surfaces of theminor arms and secure into corresponding openings or slots in the switchhousing.

Keycap assembly pins 4054 and 4057 extend away from an exterior surfaceof wings 4051 and 4052, respectively. Keycap assembly pins 4054 and 4057can attach to a keycap or substructure using pin retaining mechanisms4122 a and 4122 b (FIG. 41). Switch 4040 is disposed in the cavityformed between wings 4051 and 4052.

Half-butterfly hinge 4050 can maintain the same travel distance as abutterfly hinge but in a smaller space. Additionally, key mechanism 4112is stable when a user depresses a corner because the connection points4056 and 4058 stabilize the key mechanism 4112 and transfer the appliedforce across wings 4051 and 4052. For example, if a user depresses alower right corner of wing 4151, the force is transferred across theouter portion of wing 4151 to coupling mechanism 4130, which in turntransfers the force to wing 4152.

Referring now to FIG. 42, there is shown an illustrative perspectiveview of a switch in accordance with an embodiment. Switch 4200 is astacked dome switch that includes an upper conductive deformablestructure 4205 and a lower conductive deformable structure 4210 disposedunder the upper conductive deformable structure 4205. The upper andlower conductive deformable structures 4205 and 4210 can have anydesired shape and can be made of any suitable conductive material. Forexample, both the upper and lower conductive deformable structures canbe made of a metal. Alternatively, the upper conductive deformablestructure 4205 can be made of a metal and the lower conductivedeformable structure 4210 of a conductive elastomer such as a conductiverubber. When the switch is depressed, the upper conductive deformablestructure 4205 compresses and can contact the lower conductivedeformable structure 4210. The switch is closed or activated when theupper conductive deformable structure 4205 contacts the lower conductivedeformable structure 4210.

FIGS. 43-44 depict cross-sectional views of switch 4200 of FIG. 42 in anembodiment. In FIG. 43, upper conductive deformable structure 4205 iselectrically connected to outer terminals 4302 and lower conductivedeformable structure 4210 is electrically connected to inner terminals4306. Outer and inner terminals 4302, 4306 connect to traces or leadsthat connect to other circuitry (not shown). The traces or leads can bedisposed on or embedded within substrate 4308. When switch 4200 is in arelaxed or non-depressed state as shown, the switch is open or notactivated because upper and lower conductive deformable structures 4205and 4210 are not in contact with each other. When upper conductivedeformable structure 4205 contacts lower conductive deformable structure4210, the circuit path is complete and the switch is closed oractivated.

Switch 4200 in FIG. 44 is similar in design and operation to the switchof FIG. 43 except for the shape of lower conductive deformable structure4210. The upper conductive deformable structure in FIGS. 43 and 44 canprovide the tactile feedback to a user while the lower conductivedeformable structure can provide sound and/or feel to a key mechanism.The lower conductive deformable structure can be used to determine thetravel distance of the key mechanism.

Referring now to FIGS. 45-49, there are shown various illustrativebottom views of a keycap assembly in accordance with an embodiment. Asdescribed previously, a keycap assembly can be formed with a keycapsecured to a substructure. In some embodiments, the keycap assembly canfit within the inner perimeter of another component, such as a web. Thekeycap assemblies shown in FIGS. 45-49 can be backlit with light, suchas with an LGP.

FIG. 45 depicts a substructure 4520 that extends along the inner surfaceof the sides of keycap 4514 and includes two substructure components4506, 4504 secured to two sides of the keycap 4514. Substructurecomponents 4506, 4504 extend out from the sides of keycap 4514 into theinner bottom perimeter of keycap 4514. The substructure 4520 can beformed with any suitable material, such as, for example, a sheet metal.The substructure 4520 can be affixed to the sides of keycap 4514 by anysuitable method. For example, substructure 4520 can be attached with anadhesive or welded to the sides of keycap 4514.

The first substructure component 4506 includes pin retaining mechanisms4522 a that are configured to couple to keycap assembly pins on abutterfly or half-butterfly hinge. Although not visible in FIG. 45,second substructure component 4504 also includes pin retainingmechanisms configured to secure to keycap assembly pins on the butterflyor half-butterfly hinge. The pin retaining mechanisms are orientedtoward the underside surface of keycap 4514 and can have any givenshape. For example, in the illustrated embodiment, pin retainingmechanisms 4522 a are configured as c-clip retaining members while pinretaining mechanisms of second substructure component 4506 can have anextruded L-shape similar to pin retaining mechanisms 622 b shown in FIG.6.

The keycap 4614 in FIG. 46 includes one or more pairs of opposingsupport shelves 4606 affixed to the inner surface of the sides of keycap4614. Substructure 4620 extends between two opposing shelves 4606 andcan be secured to a pair of opposing support shelves 4606 using anysuitable attachment means. By way of example only, substructure 4620 canbe bonded or welded to support shelves 4606.

Substructure 4620 includes pin retaining mechanisms 4622 a and 4622 bthat couple with respective keycap assembly pins on a butterfly orhalf-butterfly hinge. In the illustrated embodiment, pin retainingmechanisms 4622 a are c-clip retaining members and pin retainingmechanisms 4622 b have an extruded L-shape similar to pin retainingmechanisms shown in FIGS. 6 and 45.

Referring now to FIG. 47, substructure 4720 is configured as a framethat extends along the underside surface perimeter of keycap 4714.Substructure 4720 can be made of any suitable material, such as a metal.Substructure 4720 is attached to the underside surface of keycap 4714 byany suitable method, such as with an adhesive or by welding.Substructure 4720 includes pin retaining mechanisms 4722 a and 4722 bthat couple with respective keycap assembly pins on a butterfly orhalf-butterfly hinge. Pin retaining mechanisms 4722 a and 4722 b can beconfigured similarly to the pin retaining mechanisms shown in FIGS.45-46.

In the embodiment of FIG. 48, substructure 4820 is shaped like an “X”and extends across the underside surface of keycap 4814. Substructure4820 includes pin retaining mechanisms 4822 a and 4822 b that couplewith respective keycap assembly pins on a butterfly or half-butterflyhinge. In the illustrated embodiment, pin retaining mechanisms 4822 aare c-clip retaining members and pin retaining mechanisms 4822 b have anextruded L-shape similar to pin retaining mechanisms shown in FIGS.45-47. Substructure 4820 can be made of any suitable material, such as aplastic, and can be attached to the underside surface of keycap 4814 byany suitable method.

FIG. 49 illustrates a sheet or plate substructure 4920 that is attachedto the inner bottom surface of keycap 4914. Substructure 4920 includespin retaining mechanisms 4922 a and 4922 b that couple with respectivekeycap assembly pins on a butterfly or half-butterfly hinge. The pinretaining mechanisms can be formed in any given shape and/ororientation. In the illustrated embodiment, pin retaining mechanisms2922 a are c-clip retaining members and pin retaining mechanisms 4922 bhave an extruded L-shape similar to pin retaining mechanisms shown inFIGS. 45-48.

Substructure 4920 can be made of any suitable material, such as aplastic, and can be attached to the underside of keycap 4914 by anysuitable method. Substructure 4920 can include openings 4990 that emitlight for a backlighting effect. In one embodiment, the light can beproduced by an LED component and substructure 4920 can act as a LGP.

Referring now to FIGS. 50-52, there are shown various illustrativecross-sectional views of a keycap assembly in accordance with anembodiment. Substructure 5020 includes pin retaining mechanisms 5022 aand 5022 b (FIG. 50). As with the other embodiments described herein,pin retaining mechanisms 5022 a and 5022 b can be molded with, oraffixed to substructure 5020. Keycap 5014 can be secured to substructure5020 using any suitable method, such as an adhesive.

In FIG. 51, pin retaining mechanisms 5122 a, 5122 b can be molded with,or affixed to beam 5130, which is secured to substructure 5120. Beam5130 can be made of any suitable material, such as metal or plastic.Beam 5130 and keycap 5114 can be secured to substructure 5020 using anysuitable method, including, but not limited to, an adhesive.

The substructure in FIG. 52 is separated into two components 5220 and5221. Each component can be L shaped and attached to keycap 5214 in aspaced-apart relationship. Attachment component 5206 is disposed betweenthe two L-shaped substructure components 5220 and 5221. Attachmentcomponent 5206 includes pin retaining mechanisms 5222 a and 5222 b,which can all be formed or molded in a single piece.

FIG. 53 shows an illustrative top view of a key mechanism in accordancewith an embodiment. Key mechanism 5300 is single key that rocks aboutcenter axis 5306. Glyphs 5302 and 5304 indicate a function or operationof key mechanism. In the illustrated embodiment, glyph 5302 is an uparrow and glyph 5304 a down arrow. By way of example only, a user canpress down on the up or down arrow to move a cursor displayed on ascreen.

Key mechanism 5300 can be substantially horizontal when not depressed.If a user depresses the up arrow, the key mechanism rocks downwardtoward the up arrow. Similarly, the key mechanism rocks downward towardthe down arrow when a user depresses the down arrow.

FIG. 54 shows an illustrative cross-sectional view of keycap assembly ofFIG. 53 in accordance with an embodiment. Keycap 5414 is attached tostructure 5470 through wings 5451 and 5452. Wings 5421 and 5422 can beincluded in a butterfly hinge or wings 5421, 5422 can be independentwings attached to structure 5470. A coupling mechanism can be omittedwhen the wings are included in a butterfly hinge to allow the wings andthe key mechanism to be balanced with respect to the center axis (e.g.,axis 5306).

Pin retaining mechanisms 5422 a and 5422 b on wings 5451 and 5452 securekeycap assembly pins 5454 and 5457, respectively. In the illustratedembodiment, pin retaining mechanisms 5422 a, 5422 b are attached tokeycap 5414. Other embodiments can position pin retaining mechanisms5422 a, 5422 b on a substructure that is attached to keycap 5412. Pivotpins (not shown) can be used to attach wings 5451 and 5452 to structure5470. Switches 5440 are disposed under each glyph (not shown) on keycap5414. Deformable structure 5490 can be disposed between wings 5421, 5422to restrict the downward movement of keycap 5414 when depressed. Forexample, deformable structure 5490 can prevent keycap 5414 fromactivating both switches 5440 simultaneously or sequentially. Sequentialactivation of both switches is known as a double-click event.

Referring now to FIGS. 55-57, there are shown illustrative perspectiveviews of a method for forming a keycap in accordance with an embodiment.A first layer 5500 is bonded to a second layer 5502, as shown in FIG.55. First layer 5500 can be a foil layer, such as an aluminum foillayer. The first layer can have a thickness that is less than 100microns. In some embodiments, the foil layer has a thickness ofapproximately 50 microns. Second layer 5502 can be a resin orthermoplastic layer. The first and second layers can form a keycap insome embodiments, with the first layer forming the top surface of thekeycap.

Glyph opening 5600 is formed in first layer 5500 to expose second layer5502 (FIG. 56). Glyph opening 5600 can be formed, for example, by laseretching the top surface of first layer 5500. Pressure and/or heat can beapplied to the first and second layers, causing second layer 5500 toflow into glyph opening 5600 (FIG. 57). In one embodiment, second layer5500 fills glyph opening 5600 to form a glyph 5700 on the top surface ofa keycap. Although only one glyph is formed in the illustratedembodiments, the process depicted in FIGS. 55-57 can be used to produceone or more glyphs. The one or more glyphs can represent a letter, anumber, a phrase, and a symbol, either individually or in variouscombinations. For example, on a QWERTY keyboard, the one or more glyphscan be formed on a keycap for a letter key mechanism, a number andsymbol key mechanism, or a shift or tab key mechanism.

FIGS. 58-61 show illustrative perspective views of another method forforming a keycap in accordance with an embodiment. A first layer 5800 isbonded to a second layer 5802, as shown in FIG. 58. First layer 5800 canbe a liner layer. Second layer 5802 can be a foil layer, such as analuminum foil layer. The aluminum foil layer can have a thickness thatis less than 100 microns. In some embodiments, the foil layer has athickness of approximately 50 microns.

Glyph opening 5900 is formed in second layer 5802 to expose first layer5800 (FIG. 59). Glyph opening 5900 can be formed, for example, by laseretching the back surface of second layer 5500. A material 6000 is thendeposited into glyph opening 5900 to fill glyph opening 5900 and form aglyph (FIG. 60). For example, a liquid backfill can be performed to fillglyph opening 5900. Next, as shown in FIG. 61, first layer 5800 isremoved, leaving second layer 5802 and glyph 6002. The second layer andthe glyph can form a keycap or a top surface of a keycap in someembodiments.

Various embodiments have been described in detail with particularreference to certain features thereof, but it will be understood thatvariations and modifications can be effected within the spirit and scopeof the disclosure. For example, a key mechanism can include a butterflyhinge and a half-butterfly hinge. Additionally, the switch can beconstructed differently from the switch described herein. For example,the switch can include a first conductive structure positioned over asecond conductive structure. The first conductive structure has aplunger that is positioned over the dome or top region of the secondconductive structure. The switch is closed or activated when the plungercontacts the second conductive structure.

Even though specific embodiments have been described herein, it shouldbe noted that the application is not limited to these embodiments. Inparticular, any features described with respect to one embodiment mayalso be used in other embodiments, where compatible. Likewise, thefeatures of the different embodiments may be exchanged, wherecompatible.

We claim:
 1. A key mechanism, comprising: a keycap assembly comprising:a keycap; an electronic component coupled to the keycap and comprising aflexible printed circuit; and a clip; a support structure below thekeycap assembly and comprising a pin retention member extending towardsthe keycap; a support mechanism configured to allow the keycap assemblyto move relative to the support structure and comprising: a first pinengaged with the clip to retain the support mechanism to the keycapassembly; and a second pin engaged with the pin retention member toretain the support mechanism to the support structure; and a dome switchbetween the keycap and the support structure and configured to collapsein response to actuation of the keycap assembly.
 2. The key mechanism ofclaim 1, wherein: the keycap assembly further comprises a substructure;and the clip is secured to the substructure.
 3. The key mechanism ofclaim 2, wherein the first pin is rotatably engaged with the clip. 4.The key mechanism of claim 2, wherein the substructure further comprisesa pin retaining mechanism operative to slidably engage a third pin ofthe support structure.
 5. The key mechanism of claim 2, wherein thesubstructure is coupled to the keycap.
 6. The key mechanism of claim 2,wherein the substructure is coupled to the electronic component.
 7. Thekey mechanism of claim 1, wherein the support mechanism is a butterflyhinge mechanism comprising two wings coupled together by a couplingmechanism.
 8. An electronic device comprising: a housing; a supportstructure at least partially within the housing and comprising a firstset of pin retaining members; and a key mechanism comprising: a keycapassembly comprising: a key member defining an exterior surface forreceiving user input; electronic circuitry comprising a flexible printedcircuit coupled to the key member; and a second set of pin retainingmembers; and a support mechanism coupled to the keycap assembly via thefirst set of pin retaining members, coupled to the support structure viathe second set of pin retaining members, and configured to guide thekeycap assembly between a depressed and an undepressed position.
 9. Theelectronic device of claim 8, wherein the support mechanism comprises afirst set of pins coupled to the first set of pin retaining members anda second set of pins coupled to the second set of pin retaining members.10. The electronic device of claim 8, wherein: the keycap assemblyfurther comprises a substructure; and the second set of pin retainingmembers is integrally formed with the substructure.
 11. The electronicdevice of claim 8, wherein the support structure comprises a circuitboard.
 12. The electronic device of claim 11, wherein the electroniccircuitry is electrically coupled to the circuit board.
 13. Theelectronic device of claim 8, wherein the support mechanism comprises abutterfly hinge assembly comprising: a first wing; a second wing; and aliving hinge flexibly coupling the first wing to the second wing. 14.The electronic device of claim 13, wherein: the first wing and thesecond wing define a cavity in the support mechanism; and the keymechanism further comprises a dome switch positioned at least partiallyin the cavity.
 15. A keyboard comprising: a base comprising a pinretention member; a keycap assembly comprising: a keycap; an electroniccomponent coupled to the keycap; a substructure coupled to the keycapand comprising an integral pin retention feature; a hinge coupled to thebase via the pin retention member and to the substructure via theintegral pin retention feature, the hinge configured to allow thekeycap, the electronic component, and the substructure to move in unisonrelative to the base when a key of the keyboard is actuated.
 16. Thekeyboard of claim 15, wherein the hinge comprises a first pin rotatablycoupled to the integral pin retention feature and a second pin rotatablycoupled to the pin retention member.
 17. The keyboard of claim 15,wherein the hinge is a butterfly hinge.
 18. The keyboard of claim 17,wherein the butterfly hinge comprises two wings coupled together by aflexible coupling mechanism.
 19. The keyboard of claim 15, wherein theelectronic component is secured to the substructure.
 20. The keyboard ofclaim 15, wherein the substructure is integrally formed with the keycap.